Big Misunderstanding! Intel's Micro LED Packaging Patent Thought to Target Optical Communications, Turns Out It's Just for Makin

Intel recently obtained a US patent that has attracted market attention. Initially, seeing technologies like Micro LED, glass substrates, and through-glass vias (TGV), people thought the patent might be related to optical communication applications. However, in reality, this patent is primarily for enabling CPUs to have luminous functions, serving as decorative lighting effects or operational status indicators! Isn't that hilarious! 🤣🤣🤣